| abstract |
The present invention provides a pattern forming method with excellent performance of DOF, EL and water spot defects, a resist pattern formed by the pattern forming method, an upper layer film forming composition used in the pattern forming method, and a method comprising: A method of manufacturing an electronic component according to the pattern forming method. The pattern forming method includes: step a, coating an actinic radiation-sensitive or radiation-sensitive resin composition on a substrate to form a resist film; step b, coating an upper layer film on the resist film forming a composition for forming an upper layer film on the resist film; step c, exposing the resist film on which the upper layer film is formed; and step d, using a developer solution containing an organic solvent, The exposed resist film is developed to form a pattern; and the receding contact angle of water on the surface of the upper layer film is 80° or more. |