http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106793540-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
| filingDate | 2016-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106793540-B |
| titleOfInvention | A kind of printed circuit board processing method, system and processing copper foil |
| abstract | The present invention provides a kind of printed circuit board processing method comprising following steps：S1, laser cutting：By the copper foil being pasted onto on carrier using being cut by laser out required circuit；S2, selective viscosity processing：Selective viscosity is carried out to copper foil and carrier to handle；S3, selective absorption：The corresponding copper foil in inverter circuit part carries out selective absorption after cutting；S4, stripping：The copper foil of inverter circuit part is removed from carrier, obtains being attached to the corresponding copper foil of circuit part on carrier；The copper foil of circuit part on carrier is transferred on substrate, obtains printed circuit board by the preparation of S5, printed circuit board.Circuit board can be portrayed by the method for laser cutting, production process exempts from chemical etching, and copper scrap can be recycled directly, has the great value of environmental protection while reducing the cost.A kind of new approaches are provided for the making of circuit board-use copper-clad. |
| priorityDate | 2016-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 14.