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filingDate 2015-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b88b559c223efedd47c79c87e359ba26
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publicationDate 2017-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106773532-A
titleOfInvention It is a kind of to be applied to photosensitive resin of 3D printing and preparation method thereof
abstract Photosensitive resin of 3D printing and preparation method thereof is applied to the invention provides a kind of, the photosensitive resin is by 20~40 parts of acrylate, 35~40 parts of epoxy resin, 20~30 parts of diluent, 0.1~5 part of defoamer, 0.1~5 part of levelling agent, 1~10 part of cationic initiators, 25~35 parts of 1~10 part of free radical type Photoepolymerizationinitiater initiater and Nano microsphere are prepared from.Photosensitive resin prepared by the present invention has that shaping speed is fast, excitant is small, process is simple and it is with low cost the features such as, with photosensitive resin of the present invention can directly using and be extended to 3D printing field and prepare the part with labyrinth, bending strength, shrinkage factor of the product being made etc. have larger lifting.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109370154-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109135152-A
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type http://data.epo.org/linked-data/def/patent/Publication

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