| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9a1e172c1cb9552573161352ecd4b595 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2017-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25722166a4eef779b8c8500d7f60c547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea85a129be3000cd36aa84ef9e4cff9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c98a9502bf055201089275c9345cce4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_deb41f073a0b64365840963846bfad15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20774522d002acf25a2a829974d9dafa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73ec8a82217b57667c1e036d57ab5054 |
| publicationDate |
2017-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106753027-A |
| titleOfInvention |
A two-component rapid low-temperature curing conductive adhesive |
| abstract |
The invention discloses a two-component fast low-temperature curing conductive adhesive. The following components are included in parts by mass: Conductive adhesive component A: including 180-200 parts of silver-plated copper powder, 100 parts of epoxy resin, and 10-15 parts of non-reactive diluent; conductive adhesive component B: including silver-plated copper powder 180-200 parts of copper powder, 10-15 parts of reactive diluent, 20-30 parts of curing agent, 10-20 parts of accelerator, 5 parts of leveling agent or defoamer. The invention creatively silver-plates the copper powder three times to prepare the copper powder with a high-density silver layer. The silver-plated copper powder is applied to the conductive adhesive, and a two-component fast low-temperature curing conductive adhesive is prepared. At the same time, the conductive adhesive is applied to the substrate to prepare a conductor with high conductivity and good mechanical strength. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109468102-A |
| priorityDate |
2017-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |