| abstract |
The present invention provides a kind of conductive paste, scolding tin particle can be efficiently configured on electrode, can prevent interelectrode position deviation, and interelectrode conducting reliability can be improved.Conductive paste of the invention contains Thermocurable compound and thermal curing agents and multiple scolding tin particles as Thermocurable ingredient, and the ratio of viscosity of the conductive paste in the viscosity at -80 DEG C of fusing point of the scolding tin particle relative to conductive paste at -30 DEG C of fusing point of the scolding tin particle is 1.5 or more, 4 or less. |