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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-329
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filingDate 2015-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106715761-B
titleOfInvention The manufacturing method of high-purity copper electrorefining additive and high-purity copper
abstract High-purity copper electrorefining additive of the invention, make an addition to the copper electrolyte in high-purity electrolytic copper refining, it is made of nonionic surfactant, the nonionic surfactant has the hydrophobic group containing aromatic ring and the hydrophilic group containing polyoxyalkylenes.
priorityDate 2014-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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