| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a21b7eb581dd2223a76e0c6949c6ed8a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4d80f584f045dab149cd6f63cb2f193 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2016-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7493402e849a1d4c87530ddf7ea97c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6720f58065e01059f962ae9976a72100
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cae10158129927db79ac8bcefc44361c |
| publicationDate |
2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106711085-A |
| titleOfInvention |
A kind of preparation method of flexible interconnection metal |
| abstract |
The invention discloses a method for preparing a flexible interconnection metal. The steps include: the first step is to coat a layer of positive resist on the substrate, and perform photoetching to form an uneven structure; the second step: sputtering Metal titanium/gold; Step 3: Coating AZ glue on the metal, and photoetching out interconnected metal lines; Step 4: Evaporating two layers of metal nickel/gold; Step 5: Stripping the top layer of photoresist to form a curved line interconnect metal. |
| priorityDate |
2016-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |