Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e4589b30807b53be5b8d5c09bfad19dc |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0328 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01T3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01T1-24 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01T3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-115 |
filingDate |
2015-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac52c1a54db8da732e7f83313a76eded http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_949a223f76534f671d9c7ba787628c40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_920955011196a2cad96052a4d463e645 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41e9ffff161929137c3123165bf36e59 |
publicationDate |
2017-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-106662662-A |
titleOfInvention |
Fabricating radiation-detecting structures |
abstract |
Methods for fabricating radiation-detecting structures are presented. The methods include, for instance: fabricating a radiation-detecting structure, the fabricating including: providing a semiconductor substrate, the semiconductor substrate having a plurality of cavities extending into the semiconductor substrate from a surface thereof; and electrophoretically depositing radiation-detecting particles of a radiation-detecting material into the plurality of cavities extending into the semiconductor substrate, where the electrophoretically depositing fills the plurality of cavities with the radiation-detecting particles. In one embodiment, the providing can include electrochemically etching the semiconductor substrate to form the plurality of cavities extending into the semiconductor substrate. In addition, the providing can further include patterning the surface of the semiconductor substrate with a plurality of surface defect areas, and the electrochemically etching can include using the plurality of surface defect areas to facilitate electrochemically etching into the semiconductor substrate through the plurality of surface defect areas to form the plurality of cavities. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110914715-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110914715-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114019561-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019019052-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112599620-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11322642-B2 |
priorityDate |
2014-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |