http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106609028-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_315a44d5fd8f40a37be9b24661e56e56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L91-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-16 |
| filingDate | 2015-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9074f6808c86dfa5113efcedf02b23db |
| publicationDate | 2017-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106609028-A |
| titleOfInvention | Heat dissipating material for automotive electronic product chip |
| abstract | The invention relates to a heat dissipating material for an automotive electronic product chip. The heat dissipating material is prepared from 20 to 30 parts by weight of silicon nitride, 10 to 20 parts by weight of aluminum nitride, 8 to 10 parts by weight of graphite, 6 to 10 parts by weight of paraffin, 6 to 10 parts by weight of titanium sulfate, 6 to 8 parts by weight of polycarbonate, 4 to 6 parts by weight of hydantoin epoxy resin, 2 to 4 parts by weight of sodium fluorosilicate, 2 to 5 parts by weight of zirconium dioxide sol, 1 to 3 parts by weight of a modifier, 2 to 4 parts by weight of ferrous chloride, 1 to 3 parts by weight of alum, and 1 to 3 parts by weight of silicon nitride powder. Through use of modified silicon nitride, titanium sulfate, polycarbonate, alum and silicon nitride powder, thermal conductivity, flame-retardant properties and mechanical properties are greatly improved. Through modification of silicon nitride, silicon nitride dispersion effects are improved and accumulation is avoided. The automobile electronic product chip prepared from the heat dissipating material has high temperature resistance, aging resistance and a long service life. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109021529-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109021937-A |
| priorityDate | 2015-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.