http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106543440-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-05 |
| filingDate | 2016-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106543440-B |
| titleOfInvention | Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof |
| abstract | The present invention relates to a kind of annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof.The present invention synthesizes annular oligomeric silsesquioxanes (MOSS) (component A), synthesis terminal hydroxy ethylene polysiloxanes (component B), then A, B component is according to 1:(1 ~ 5) mass ratio mixing, recycle chloroplatinic acid catalyst carry out Si―H addition reaction solidification preparation LED encapsulation use MOSS modified organic silicon packaging plastic.Preparation process of the present invention is simple, synthetic yield is high；The packaging plastic has good thermal stability and higher refractive index, and translucency is preferable, can solidify at a lower temperature.The MOSS modified organic silicon packaging plastic of preparation 500 nm wavelength light transmittance 90% or more, refractive index at a temperature of 25 DEG C is 1.535, thermal gravimetric analysis results show that the thermal decomposition temperature of the packaging plastic is 416 DEG C, it is 57% in 700 DEG C of residual rates, show preferable heat resistance, the tensile strength and elongation at break of the packaging plastic are respectively 1.88 MPa and 157%, Shore A hardness 36. |
| priorityDate | 2016-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.