http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106486348-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76813 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76828 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0338 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2016-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106486348-B |
| titleOfInvention | Contact hole shaping method |
| abstract | The method for forming contact hole includes: (a) substrate of the setting comprising multiple column patterns on layer to be patterned；(b) hard mask layer is formed on the column pattern and the layer to be patterned；(c) the coated pattern treatment compositions on the hard mask layer, wherein the pattern treatment compositions include polymer and solvent containing reactive surfaces attachment group；And optionally toast the substrate；Wherein the polymer becomes to be bonded to the hard mask layer to form polymeric layer on the hard mask layer；And (d) substrate is handled to remove the remaining unbonded polymer with the solvent-laden wash reagent of packet, to form the first hole being placed between multiple surrounding column patterns.The method handles the substrate from the coating pattern treatment compositions to the solvent, avoids that the polymer is made to be exposed to activating radiation.The electronic device for additionally providing pattern treatment compositions and being formed by the method.Present invention is particularly suitable for manufactures to provide the semiconductor device of high-resolution contact hole pattern. |
| priorityDate | 2015-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 182.