http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106480481-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 2016-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106480481-B |
| titleOfInvention | Edge Flow Elements for Electroplating Devices |
| abstract | The present invention relates to edge flow elements for use in electroplating apparatus, and in particular to methods and apparatus for electroplating one or more materials onto a substrate. In many cases, the material is a metal and the substrate is a semiconductor wafer, but is not limited thereto. In general, embodiments of the present invention utilize channeled plates positioned adjacent to the substrate to create transverse flow manifolds defined by channeled plates at the bottom, substrate at the top, and lateral flow confinement rings at the sides Tube. Edge flow elements configured to direct the electrolyte into the corner formed between the substrate and the substrate holder are also typically provided. During electroplating, fluid passes up the channels in the channeled plate and laterally through the cross-flow side inlet located on one side of the cross-flow confinement ring, into the cross-flow manifold. The flow paths are combined in the cross-flow manifold and the outlet is at the cross-flow outlet opposite the cross-flow inlet. These combined flow paths and edge flow elements result in improved plating uniformity, especially at the periphery of the substrate. |
| priorityDate | 2015-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.