| abstract |
The present invention provide a kind of bonding metal plates each other and bonding metal plates and when ceramic wafer prevent the mutual position in the joint surface of each component from deviateing, can effectively manufacture they conjugant engagement manufacturing method and the power module substrate that the conjugant is applied to power module substrate manufacturing method.The manufacturing method of conjugant of the invention includes lamination process, material (40) are fixed temporarily using saturated fatty acid as principal component in the upper coating of any of copper circuit board (the 1st component) (30) or ceramic substrate (the 2nd component) (20), copper circuit board (30) and ceramic substrate (20) are subjected to stacking contraposition via the material (40) that is fixed temporarily of melting, and cooling is fixed temporarily material (40), to form the laminated body (80) that copper circuit board (30) and ceramic substrate (20) be laminated are temporarily fixedï¼›And bonding process, the conjugant for engaging copper circuit board (30) with ceramic substrate (20) is formed to laminated body (80) pressurized, heated in the stacking direction. |