| abstract |
The invention provides an epoxy resin composition for electronic materials, which contains a polyfunctional biphenyl type epoxy resin which is triglycidyloxybiphenyl or tetraglycidyloxybiphenyl and a curing agent or curing accelerator at least one of them. Moreover, this invention provides the epoxy resin composition for electronic materials which further contains a filler, especially a thermally conductive filler. Moreover, this invention provides the hardened|cured material obtained by hardening the epoxy resin composition for electronic materials, and the electronic member containing this hardened|cured material. |