| abstract |
The present invention provides a kind of methods for manufacturing electronic device, electronic device has the current-collector of high specific charge collecting zone and power, and simple and quick technology can be used to realize in this method, and produces a kind of Robustness Design that can be bent and can manufacture in large-scale process flow.For this purpose, the electronic device includes the electronic circuit equipped with the current-collector formed by metal substrate, which has the face for the high aspect ratio structure for forming cylinder of the minimum spacing greater than 600nm.By forming high aspect ratio structure on metallic substrates, new structure is formd, the new structure and the structure that Macroscopic Curvature is conformal or this is new can be wound or crimp and have Robustness Design. |