| abstract |
The method for metallizing the surface of the dielectric substrate of the present invention, the surface of the dielectric substrate is treated with atmospheric pressure plasma using a rare gas to generate peroxide free radicals, and the grafting agent is reacted with the grafting agent to form a coordination bond with the silver ion. The combined functional groups are fixed, coated with a silver-containing composition containing 10 to 50% by mass of the silver compound (A) of formula (1) and 50 to 90% by mass of the amine compound (B) of formula (2), heated and cured to form The silver thin film layer can form a metal film with high adhesion on the surface of a fluororesin that is suitable as a dielectric substrate but has extremely low adhesion, although there is no delay in the signal propagation speed or an increase in power consumption by this method. . (R 1 : hydrogen, -(CY 2 )a-CH 3 or -((CH 2 )b-O-CHZ)c-CH 3 , R 2 :-(CY 2 )d-CH 3 or -((CH 2 )e-O-CHZ)f-CH 3 . Y: Hydrogen atom or -(CH 2 )g-CH 3 , Z: Hydrogen atom or -(CH 2 )h-CH 3 . a: Integer of 0 to 8 , b: an integer from 1 to 4, c: an integer from 1 to 3, d: an integer from 1 to 8, e: an integer from 1 to 4, f: an integer from 1 to 3, g: an integer from 1 to 3, h : an integer from 1 to 2.) |