| abstract |
The present invention provides an assembled structure that does not easily cause solder flash even when double-sided assembly is performed, and a manufacturing method thereof. The assembly structure of the present invention is one in which the assembly part (1) is assembled to the assembly surface (101) of the assembled part (8), and the assembly part (9) is assembled to the assembly surface (102) of the assembled part (8). An assembly structure provided with a reinforcing resin (6) whose base end is connected to an assembly surface (101) of a component to be assembled (101) to cover a part of the solder (5) in its entirety, and whose tip does not come into contact with bumps (4). , since a part of the solder (5) is exposed through the exposed portion (Oa) formed between the front end of the reinforcing resin (6) and the substrate (2) of the assembled part (1), it is The secondary reflow when the assembly part (9) is assembled on the assembly surface (102) spreads the remelted solder (5) from the exposed portion (Oa) to the outside, and the solder (5) returns to its original position by cooling. |