http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106398106-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J161-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-109 |
| filingDate | 2016-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106398106-B |
| titleOfInvention | A kind of compound curing agent of wood-based plate phenolic resin and its application |
| abstract | The present invention relates to wood-based plate curing agent, specifically disclose the compound curing agent of wood-based plate phenolic resin and its application.The curing agent is by carbonic ester and bicarbonate with 1.0~1.5:1.0~2.0 mass ratio composition, wherein, carbonic ester can improve rapidly the viscosity of phenolic resin, there is good help to the precompressed of wood-based plate, bicarbonate salts component, serves latent cured, is acted on carbonates in hot pressing, solidification is completed in collaboration, preferably improves wood-based plate intensity.Based on this, the present invention also provides a kind of artificial plywoods, the compacting of glued board are carried out under conditions of 1.0MPa, 110~120 DEG C using the curing agent and phenolic resin adhesive, and screened the optimum proportioning of curing agent and phenolic resin adhesive.Curing agent of the present invention can significantly reduce solidification temperature, improve curing rate, moreover it is possible to improve the mechanical property (such as bonding strength) of produced artificial plywood. |
| priorityDate | 2016-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.