http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106391925-B
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21F1-004 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B21F1-00 |
filingDate | 2016-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2018-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2018-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-106391925-B |
titleOfInvention | The bending mechanism and its method of work of a kind of stamp-mounting-paper diode |
abstract | The bending mechanism and its method of work of a kind of stamp-mounting-paper diode.It is related to Bending Mould field.A kind of delicate structure, easy to use, high degree of automation and high precision machining are proposed, and while highly-efficient processing is kept, effectively can avoid causing pin surface the bending mechanism and its method of work of the stamp-mounting-paper diode of damage in use.The upper die component includes cope plate, cope plate drive component, a pair of of upper mold and a pair of of upper mold drive component, the cope plate is socketed the guide post, the top of the upper mold extend out to the top of the cope plate, and the upper mold drive component is fixedly connected on the top surface of cope plate and for the upper mold to be driven to do straight reciprocating motion;The bottom end of the upper mold is hinged with pinch roller.The present invention has the characteristics that easy to use, high degree of automation, high precision machining, high in machining efficiency and rejection rate are low on the whole. |
priorityDate | 2016-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.