http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106376182-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4cfa8b9c6673451b402b4d68aee86ba6 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0126 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05C1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05C11-1026 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C11-10 |
| filingDate | 2016-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d913bc84ab63d820bfd8fe0dabdd6940 |
| publicationDate | 2017-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106376182-A |
| titleOfInvention | Method and device for producing double face and multilayer circuit boards via hole wall gluing method |
| abstract | The invention discloses a method and device for producing double face and multilayer circuit boards via a hole wall gluing method and belongs to the field of printed circuit board processing. A problem of how to protect hole wall metal when anti-corrosion circuit patterns are made via wet film exposure, the anti-corrosion circuit patterns are printed via silk screens and the anti-corrosion patterns are imaged via laser is solved. The method comprises the following steps: 1) viscosity of a glue solution is adjusted, 2) a hole wall is coated with liquid state hole wall anti-corrosion glue, 3) a drying step is conducted, and 4) glue films on two faces of a working plate are removed. According to the method for producing the double face and multilayer circuit boards via the hole wall gluing method, wet film printing and etching technologies are adopted; the circuit boards that are produced thereby are advantaged by high precision of circuit patterns, small lateral erosion quantities and large wiring density; conduction disc-free circuit boards can be produced. A hole wall gluing machine disclosed in the invention is simple in structure, convenient in production, low in cost, reliable in product quality and high in working efficiency; the glue solution can be automatically supplemented, concentration of the glue solution can be automatically adjusted, a fault indicating function and an alarming function can be fulfilled, and the hole wall gluing machine is a powerful weapon for enterprise competition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108724814-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107309148-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107309148-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114203567-A |
| priorityDate | 2016-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.