http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106338627-B

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2875
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-073
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 2016-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106338627-B
titleOfInvention Probe card, heat insulating cover assembly and semiconductor device testing apparatus
abstract The invention discloses a probe card and a heat insulation cover assembly for the probe card, wherein the probe card comprises: a circuit substrate which transmits an electrical signal for testing the semiconductor device; a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes; and a heat insulating cover assembly on an upper surface of the circuit substrate, the heat insulating cover assembly covering at least a portion of the circuit substrate and defining a heat receiving space, the heat insulating cover assembly retaining heat applied to the circuit substrate within the heat receiving space.
priorityDate 2015-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758

Total number of triples: 19.