http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106338627-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2863 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2875 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-073 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
filingDate | 2016-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-106338627-B |
titleOfInvention | Probe card, heat insulating cover assembly and semiconductor device testing apparatus |
abstract | The invention discloses a probe card and a heat insulation cover assembly for the probe card, wherein the probe card comprises: a circuit substrate which transmits an electrical signal for testing the semiconductor device; a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes; and a heat insulating cover assembly on an upper surface of the circuit substrate, the heat insulating cover assembly covering at least a portion of the circuit substrate and defining a heat receiving space, the heat insulating cover assembly retaining heat applied to the circuit substrate within the heat receiving space. |
priorityDate | 2015-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
---|---|
isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758 |
Total number of triples: 19.