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filingDate 2016-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106318264-B
titleOfInvention The preparation method of the heat-conducting glue of BN/Ag two-dimensional layer composite material
abstract The present invention provides a kind of preparation method of the heat-conducting glue of BN/Ag two-dimensional layer composite material, two-dimensional layer boron nitride pellicle is prepared using solvent stripping means, the nano-silver ionic of preparation is loaded on boron nitride pellicle by reasonable technique, finally this compound is filled into heat-conducting glue.The boron nitride pellicle for having loaded silver ion enhances the heat transfer efficiency of heat-conducting glue, it is possible to this special heat-conducting glue is applied in the high-power electronic device of high heat flux density.
priorityDate 2016-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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