http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106317900-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 |
| filingDate | 2016-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106317900-B |
| titleOfInvention | A kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property |
| abstract | The invention discloses a kind of dielectric resilience silica gel pad and preparation method thereof with special adhesive property, the dielectric resilience silica gel pad are formed by ethenyl blocking phenyl silicone oil, liquid silicone, containing hydrogen silicone oil, modified filler, fire retardant and catalyst preparation.Preparation method includes the following steps: 1) prepared by base-material: kneader is added in ethenyl blocking phenyl silicone oil, liquid silicone, modified filler and fire retardant, is mediated, adds containing hydrogen silicone oil and catalyst, mediated, obtain base-material；2) deaeration: the vacuumizing and defoaming when mediating；3) vulcanize: roll squeezer is added in the base-material for carrying out deaeration processing, is pressed into certain thickness gasket, then carry out baking vulcanization.The initial bond strength of dielectric resilience silica gel pad of the invention is lower, is convenient for constructing operation, over time, bonding force can significantly increase, and good adhesion strength just can be reached after 48 hours；Preparation method of the invention is easy to operate, and production cost is low. |
| priorityDate | 2016-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.