http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106298557-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11614 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2015-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106298557-B |
| titleOfInvention | A Low-Temperature Bonding Method Based on Au/In Isothermal Solidification |
| abstract | The invention discloses a low-temperature bonding method based on Au/In isothermal solidification, comprising: forming a first gold pattern layer on a bonding surface of a first substrate; forming a bump pattern on the bonding surface of a second substrate forming a second gold pattern layer and an indium pattern layer covering the bump pattern layer in sequence on the bonding surface of the second substrate; connecting the bonding surface of the first substrate with the second substrate align and secure the bonding surfaces for bonding. The invention uses a bump pattern layer on the bottom layer of the metal film, which not only reduces the bonding alignment accuracy, but also enhances the contact force during the bonding process, which can greatly improve the bonding quality. |
| priorityDate | 2015-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.