| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f8f91b8ca0e89187ef64cd5aa2939513 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B2201-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-076 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G10K11-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0662
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-2048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0637
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-1051 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B06B1-06 |
| filingDate |
2012-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_609604e598b989fcf4590f66115fdd53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce8e4f3067836ed40093ef0e17d4deee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f70ab7e90c3931f4f29ccd33f3feda57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3dd391ff4274d9c97da63be64d82a01 |
| publicationDate |
2017-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106269451-A |
| titleOfInvention |
Piezoelectric transducers using microdome arrays |
| abstract |
An ultrasonic piezoelectric transducer device includes a transducer array and a base, the transducer array is composed of a vibrating element array, and the vibrating element array in the transducer array is attached to the base. The substrate includes integrated electrical interconnects for communicating drive and sense signals between the vibrating element and external control circuitry. The substrate may be an ASIC wafer, which includes integrated circuits for controlling the driving and processing of the sensed signals. Interconnection and control circuitry in the substrate is substantially assembled in the area beneath the array of multiple vibrating elements. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109218931-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109696260-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109218931-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111491238-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10674281-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11006223-B2 |
| priorityDate |
2011-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |