| abstract |
The present invention is a curable silicon composition comprising: (A) in an average unit formula: (R 1 3 SiO 1/2 ) x (R 2 2 SiO 2/2 ) y (R 3 SiO 3/2 ) z (R 1 is an alkyl group, an alkenyl group, an aryl group, or an aralkyl group, R 2 is an alkyl group or an alkenyl group, and R 3 is an alkyl group, an aryl group, or an aralkyl group, wherein, in one molecule, R 1 to At least 0.5 mole percent of R 3 is alkenyl, at least one of R 3 is aryl or aralkyl, 0.01≤x≤0.5, 0.01≤y≤0.4, 0.1≤z≤0.9, and x+y+z=1 ); (B) linear organopolysiloxane having at least two alkenyl groups in one molecule; (C) at least two hydrogen atoms bonded to silicon atoms in one molecule The organopolysiloxane; and (D) a catalyst for a hydrosilylation reaction. The dispersibility of the phosphor of this curable silicon composition is good, and a cured product having crack resistance can be formed. |