http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106243720-B

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filingDate 2016-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106243720-B
titleOfInvention Thermally conductive silicone putty compositions
abstract The present invention relates to a heat-conductive silicone putty composition containing the following components (a) to (D): (A) a kinematic viscosity at 25 ℃ represented by the following formula (1) of 10 to 100,000mm 2 An organopolysiloxane, (B) an organopolysiloxane raw rubber having an absolute viscosity of 5,000 to 40,000 mPas at 25 ℃ when 30 mass% of an organopolysiloxane soluble in xylene is dissolved in xylene, (C) an aluminum hydroxide powder having an average particle size of 0.5 to 10 μm, and (D) 1 or more inorganic compound powders selected from the group consisting of aluminum powders, zinc oxide powders, aluminum oxide powders, boron nitride powders, and aluminum nitride powders having an average particle size of 0.5 to 100 μm. The composition of the present invention has fluidity, but the offset resistance is remarkably improved. R 1 a SiO (4‑a)/2 (1)[R 1 Is 1 or more than 2 groups selected from saturated or unsaturated monovalent hydrocarbon groups with carbon number of 1-18, a is 1.8 ≦ a ≦ 2.2]。
priorityDate 2015-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 44.