| abstract |
The method that certain embodiments of the present invention is related to applying the Frit paste in component (for example, Vacuum IG unit or plasma panel) and prepares the component.The frit powder be it is substantially unleaded, provide aqueous solvent in the first temperature.Other aqueous solvent is added into intermediate blend to form Frit paste.Other aqueous solvent is provided in second temperature, the second temperature is lower than the first temperature.Relative to the Frit paste or without the frit of frit powder, the weight percent concentration of provided binder material is 0.001%-20%.The bulk viscosity of the Frit paste is 2,000-200,000cps. |