http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106181132-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 |
| filingDate | 2016-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106181132-B |
| titleOfInvention | A kind of high-temp solder preparation method based on Ag@Sn nucleocapsid structures |
| abstract | The present invention provides a kind of high-temp solder preparation methods based on Ag@Sn nucleocapsid metal powders, the high-temp solder uses micro-, nanoscale Ag@Sn nucleocapsid metal powders, and the plating subsidiary formula method for the thick tin layers for attaching solderability thickness by micro-, Nanometer Copper ball surface plating is realized.Welding is carried out using preset that the high-temp solder is suppressed, and (250 DEG C) welding of low temperature can be realized, gained solder joint is amenable to (480 DEG C) military services of high temperature, and the stability for greatly improving welding spot reliability and weld seam can be widely applied to various high-temperature soldering fields. |
| priorityDate | 2016-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.