http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106164178-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C41-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2015-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106164178-B |
| titleOfInvention | Composition is used in manufacturing method and the resin film formation of resin film |
| abstract | The purpose of the present invention is to provide, not only excellent heat resistance, but also there is the resin film for postponing low such feature, especially it is suitable as the manufacturing method of the resin film of the substrate of flexible device and the resin film formation composition of the resin film and the such resin film of formation.Solution of the invention is to be related to a kind of manufacturing method of resin film, it is characterized in that, using containing polyimides, the resin film of silicon dioxide granule and organic solvent, which is formed, uses composition, the polyimides is to carry out polyamic acid obtained from imidizate, the polyamic acid is obtained from reacting tetracarboxylic dianhydride's ingredient comprising ester ring type tetracarboxylic dianhydride with the diamine component comprising fluorinated aromatic diamines, the average grain diameter of the silicon dioxide granule is 100nm or less, the average grain diameter is calculated by the specific surface area value measured using nitrogen adsorption method. |
| priorityDate | 2014-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 217.