http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106159043-B

Outgoing Links

Predicate Object
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00
filingDate 2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106159043-B
titleOfInvention Flip LED chip and forming method thereof
abstract The invention provides a flip LED chip and a forming method thereof, wherein the forming method comprises the following steps: providing a substrate; forming an N-type semiconductor layer, an active layer and a P-type semiconductor layer; forming an opening exposing a part of the N-type semiconductor layer; p, N forming an electrode layer and an insulating reflecting layer; forming P, N an electrode structure. The flip LED chip comprises a substrate, an N-type semiconductor layer, an active layer and a P-type semiconductor layer; a P electrode layer is arranged on the P type semiconductor layer, and an N electrode layer is arranged on the N type semiconductor layer in the opening; the insulating reflecting layer covers the P-type semiconductor layer, the P electrode layer, the N-type semiconductor layer and the N electrode layer; and the P electrode structure is formed in the insulating reflecting layer and is electrically connected with the P electrode layer, and the N electrode structure is electrically connected with the N electrode layer. The flip LED chip has the beneficial effects that the insulating reflecting layer can reflect part of light to the substrate while playing a role of insulating and isolating, so that the light transmittance of the flip LED chip is increased.
priorityDate 2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 35.