http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106158731-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2015-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106158731-B |
| titleOfInvention | The forming method of interconnection structure |
| abstract | A kind of forming method of interconnection structure, comprising: substrate is provided, front layer is formed in substrate and waits for connector；Patterned first photoresist layer is formed on the substrate；Cure process is carried out to the first photoresist layer；Filled layer is formed on the first photoresist layer；Patterned second photoresist layer is formed on filled layer；Using the second photoresist layer as mask, the third opening for exposing the first photoresist layer is formed；In the pattern transfer to substrate of third opening, fourth opening exposing front layer wait for connector will be formed in substrate；Conductive material is filled into the 4th opening, to form interconnection structure.The present invention passes through the fixed figure to define the first photoresist of contact hole site, make the definition of the lesser contact hole site of size can be prior to larger-size rear definition of the layer to connector position, avoid the superposition of the stacking deviation of Twi-lithography, contact hole etching process window can effectively be expanded, the yields in device manufacturing processes is improved, device manufacturing cost is reduced. |
| priorityDate | 2015-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.