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filingDate 2016-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106146729-B
titleOfInvention A kind of selfreparing flexible printed circuit board and preparation method thereof
abstract The invention discloses a kind of selfreparing flexible printed circuit board and preparation method thereof, the base material of the circuit board is made up of the selfreparing hydrogel elastic body based on dynamic boric acid ester bond, and the parts by weight of raw material and each raw material contained by the base material are:30 70 parts of vinyl monomer or polymer containing hydrophilic radical, 5 35 parts of the vinyl monomer or polymer of hydroxyl, 28 parts of boron-containing compound, 15 35 parts of water, 0.5 1 parts of radical initiator.The dynamic boric acid ester bond that the present invention is formed by hydroxyl and borate assigns hydrogel elastic body self-regeneration function, boric acid ester bond is as dynamic covalent bond, have intensity, the invertibity and plasticity of physical crosslinking of covalent bond concurrently, so as to assign material self-healing properties, extend the service life of material;Meanwhile its raw material is cheap and easy to get, preparation technology is simple, and has preferable comprehensive mechanical performance.
priorityDate 2016-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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