http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106117556-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14 |
| filingDate | 2016-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106117556-B |
| titleOfInvention | Soluble polyamideimide resin, and flexible metal-clad plate and flexible printed circuit board obtained from the resin |
| abstract | The invention provides a soluble polyamide-imide resin which has excellent heat resistance, economy and low thermal expansion, and a flexible metal-clad plate and a flexible printed circuit board which use the resin as a base film and a cover film. The flexible printed circuit board is a flexible printed circuit board in which a metal foil is directly laminated or laminated via an adhesive layer on at least one surface of a polyamide-imide resin layer mainly composed of trimellitic anhydride and diphenylmethane diisocyanate as an inner base film or an outer surface cover film, and is characterized in that: 1) the soluble polyamide-imide resin has a logarithmic specific viscosity of greater than 0.9dL/g and less than 2.5 dL/g at 30.0 deg.C and 0.5g/dL concentration with N-methylpyrrolidone as solvent; 2) the polyamide-imide resin is prepared into a dry film with the thickness of 10-100 mu m by a known method such as direct tape casting without any stretching in a direction parallel to the film plane, and the linear thermal expansion coefficient of the polyamide-imide resin is 20-35 ppm/DEG C at 100-200 ℃. |
| priorityDate | 2016-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 97.