http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106103639-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J23-745 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2015-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106103639-B |
| titleOfInvention | Composition for chemical mechanical polishing of tungsten |
| abstract | A chemical mechanical polishing composition for polishing a substrate with a tungsten layer, comprising a water-based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6mV, and The polycationic amine compound in solution in the liquid carrier. A method for chemical mechanical polishing of a substrate comprising a tungsten layer, comprising: contacting the substrate with the above-described polishing composition, moving the polishing composition relative to the substrate, and grinding the substrate to remove a portion of the tungsten from the substrate And thereby polish the substrate. |
| priorityDate | 2014-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 195.