| abstract |
When present invention offer is had the substrate with the mounting surface for installing semiconductor element and the encapsulation phosphor bodies with the frame-shaped portion that the mounting surface is made of and surrounded curable resin, is formd the semiconductor element mounting packaging body of recess portion by mounting surface and encapsulation phosphor bodies using mold manufacture, do not generate substrate recess and damage and from the bad situation of mold releasability, the manufacturing method of resin burr, and the mold release film suitable for the manufacturing method can be prevented.The substantially certain mold release film of integral thickness is configured in the upper mold with shape protrusion corresponding with the recess portion of semiconductor element mounting packaging body, substrate is configured in lower mold, by the upper mold and the lower mold clamping, keep the mounting surface of the protrusion and the substrate closely sealed by the mold release film, it is full of curable resin in the space being formed between the upper mold and the lower mold and is allowed to solidify, the solidfied material and substrate are simultaneously from mold releasability. |