| abstract |
The present invention relates to film for flip chip type semiconductor back surface and dicing tape-integrated film for semiconductor back surface.The film for flip chip type semiconductor back surface being connected to the present invention relates to flip-chip to be formed on the semiconductor element back side on adherend, wherein when the film is formed on the semiconductor element back side, the film its face not towards the semiconductor element back side surface roughness (Ra) before curing in 50nm-3 μ m, it is wherein 5~95 parts by weight relative to the amount of 100 parts by weight organic resin component inorganic fillers, also, wherein the film for flip chip type semiconductor back surface is formed in the whole surface of pressure sensitive adhesive layer. |