| abstract |
An object of the present invention is to provide a resin composition for sealing an electronic device that seals against a substrate without trapping air and can suppress permeation of water vapor, and an electronic device using the resin composition for sealing an electronic device. The solution is a resin composition for encapsulating electronic equipment, characterized in that it contains (A) a polybutadiene polymer having a (meth)acryloyl group at the end represented by the following chemical formula (1) and (B) A photopolymerization initiator, and does not contain thermoplastic resins with a mass average molecular weight of more than 50,000. (In the formula, R 1 and R 2 represent hydroxyl or H 2 C=C(R 7 )-COO-; R 3 and R 4 represent substituted or unsubstituted divalent organic groups with 1 to 16 carbons and do not contain N group; R 5 , R 6 , R 7 represent a hydrogen atom or an alkyl group with 1 to 10 carbons. 1 and m are integers representing 0 or 1; n is an integer representing 15 to 150, x:y=0 to 100 : 100 to 0. Among them, there is no case where R 1 and R 2 are both hydroxyl groups). |