http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106028641-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10734 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09445 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2016-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106028641-B |
| titleOfInvention | Vertical interconnection structure and method between LTCC and PCB based on high-frequency transmission |
| abstract | The present invention relates to the transmission of broadband high-frequency signals, belong to electrical interconnection field, more particularly, to vertical interconnection structure and method between a kind of LTCC and PCB based on high-frequency transmission.In view of the problems of the existing technology the present invention, provides a kind of vertical interconnection structure and method, designed interconnection architecture is based on ball grid array (Ball Grid Array, hereinafter referred to as BGA) welding structure, is conducive to miniaturization, the highdensity system integration.The present invention includes LTCC component, PCB component and interconnection structure, by carrying out plant ball bonding on the pad of the 2nd similar axle construction of LTCC component, then the LTCC component of soldered ball will have been planted as a device, it is assembled on PCB component using standard SMT process, so that the 2nd similar axle construction of LTCC component realizes the vertical interconnection of LTCC component and PCB component by coaxial configuration interconnection in soldered ball, with the first PCB component. |
| priorityDate | 2016-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.