| abstract |
Present invention offer is a kind of can be in the manufacture method for being used as golden or its alloy further to improve the electronic installation and electronic installation of adhesion reliability in the structure of distribution.Electronic installation (14) possesses：Substrate (pressure chamber substrate (29) and oscillating plate (31)) is driven, it is formed with the electrode wiring (44,45) involved by piezoelectric element (32) and the driving of the piezoelectric element；Sealing plate (33), it is engaged with the driving substrate, electrode wiring is formed using the distribution metal containing golden (Au) in a manner of being formed on as being close to layer (50) of basalis on driving substrate, and there are removal portion (49), the removal portion (49) will make to be close to layer to expose including removing with a part for the distribution metal in the region including the part that engages of engagement resin 43. |