| abstract |
The objective of the present invention is to provide: a highly heat-resistant epoxy resin having superior thermal stability and high heat resistance; a curable resin composition; and a cured product thereof. The epoxy resin is represented by formula (1), in the entire surface area of a chart measured by means of gel permeation chromatography, triglycidyl ether bodies account for 40-75 area% and tetraglycidyl ether bodies account for 12-40 area%, the total of the triglycidyl ether bodies and tetraglycidyl ether bodies is 52-90 area%, and the tetraglycidyl ether bodies have the structure represented by formula (2). (In formula 1, the plurality of A and B present are as indicated above, and are bonded by *. Also, G indicates a glycidyl group, and m and n indicate the average number of repeats and represent a number from 0 to 5. In formula 2, G represents a glycidyl group.) |