Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-14327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-3481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A45C2011-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-14868 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2101-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2709-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2101-10 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A45C11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14311 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
filingDate |
2016-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2019-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-105960116-B |
titleOfInvention |
Co-molded ceramics and polymer architecture |
abstract |
This disclosure relates to co-molded ceramics and polymer architecture.Disclose the method for manufacturing co-molded housing parts for electronic equipment.The component formed from ceramic material is placed in mold.Mold includes that definition is configured as receiving the first part of the first cavity of the first component, and defines the second part of the second cavity communicated when mold is closed with the first cavity.Second cavity is the shape of the feature of ceramic material to be joined to.Thus polymer material is formed this feature from polymer material and this feature is integrated to ceramic material by the second cavity of injection.Polymer material is cured.The first component and feature are formed together housing parts for electronic equipment. |
priorityDate |
2015-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |