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filingDate 2015-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105934307-B
titleOfInvention Roughening treatment copper foil, copper clad laminate and printed wiring board
abstract By using the roughening treatment copper foil of laser boring processing, so as to be suitable for the formation of the accumulation horizon of printed wiring board, the good multilayer printed circuit board of quality can be formed.The roughening treatment copper foil of the laser boring processing has roughening treatment face on copper foil two sides, and a face of the copper foil is the coplanar laser illumination for being subject to laser to irradiate in Laser Processing, another face is the bonding plane with insulating layer constituent material, and the roughening treatment face has the minute concave-convex structure that be made of the copper complex chemical compound containing cupric oxide, maximum length is formed for needle-shaped or sheet the convex shaped part of below 500nm.
priorityDate 2014-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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