http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105934110-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1484 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2016-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105934110-B |
| titleOfInvention | The sandwich structure and method for producing multi-layer board of ultra-thin multi-layer board processing |
| abstract | The present invention provides a kind of method that multi-layer board makes, and is first pressed together on a loading plate upper and lower surface two double face coppers by the second prepreg, third prepreg low temperature, forms the sandwich structure of ultra-thin multi-layer board processing；Then the blind hole in upper and lower double face copper is formed by laser drill in the sandwich structure upper and lower surface of ultra-thin multi-layer board processing；Then the another side circuit in two double face coppers is formed by metallization in the structure of step S5；Then in the sandwich structure upper and lower surface of ultra-thin multi-layer board processing by two outer copper foils by the 4th prepreg, the 5th prepreg high-temperature laminating, form sandwich structure after solidification；Two four-layer circuit board structures are formed on the outside of the release film of loading plate；Finally two four-layer circuit board structures on the outside of the release film of loading plate are peeled.The present invention can reduce technology difficulty, once manufacture two circuit boards, improve efficiency；It solves to make the warpage issues that substrate generates. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110769606-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110769606-B |
| priorityDate | 2016-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.