| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3b0a3dbf8d6c9712d86ea1383fd5327 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2014-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_136ab47c74fa2ccfba72c4c8e8fb099d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d922060f36c9e42a8dc3e9729f856cb8 |
| publicationDate |
2016-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105849895-A |
| titleOfInvention |
Substrate for power module, method for manufacturing same, and power module |
| abstract |
A thin and long groove (35) is formed so as to link an Ag layer (32) and an exposed portion of a circuit layer surrounding the Ag layer (32). The groove (35) is a thin and long recess extending from the surface of the Ag layer (32) through a glass layer (31) and an aluminum oxide coating (12A) to the surface (12a) of the circuit layer (12). An extended part (36), in which a part of the Ag layer (32) is extended along the inner surface (35a) of the groove (35), is formed in the groove (35). The extended part (36) establishes a direct electrical connection between the Ag layer (32) and the circuit layer (12) at the portion at which the groove (35) is formed, the connection being established using Ag, which has low electrical resistance. |
| priorityDate |
2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |