http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105829556-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22D21-005 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00 |
| filingDate | 2014-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-105829556-B |
| titleOfInvention | The manufacture method of copper alloy plate, connector and copper alloy plate |
| abstract | In order to which the copper alloy plate for having taken into account high-yield strength, good bendability, good electrical conductivity for being suitable for connector etc. is made, there is provided a kind of copper alloy plate, used the connector of the copper alloy plate and the manufacture method of the copper alloy plate.The copper alloy plate has following compositions：Containing any a kind or 2 kinds in the Ni and Co that add up to the mass % of 1.80 mass %~8.00, the mass % of 0.40 mass %~2.00 Si and add up to being selected from by least one of Sn, Zn, Ag, Mn, P, Mg, Cr, Zr, Fe and Ti group formed element of the mass % of 0.000 mass %~2.000, and remaining part is made up of copper and inevitable impurity, { 121 }<111>The orientation density of orientation is less than 6, { 110 }<001>The orientation density of orientation is more than 4, is had { 110 }<001>The density of the crystal grain of orientation is 0.40/μm 2 More than. |
| priorityDate | 2013-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.