| abstract |
This application involves cured products and application thereof.Cured product has excellent machinability, workability, adhesiveness etc., and will not cause viscosity, the muddiness etc. on surface.Cured product has the excellent transparency, moisture resistance, mechanical property, crack resistance etc..By being used as the encapsulant or jointing material of semiconductor device, cured product can for example provide the device with excellent long-term reliability. |