| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2014-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105814242-B |
| titleOfInvention |
The manufacturing method of surface treatment copper foil, copper-cover laminated plate, printing distributing board, e-machine and printing distributing board |
| abstract |
The present invention provides a kind of surface treatment copper foil that the transparency removing the resin after copper foil using etching is excellent.The surface treatment copper foil of the present invention is surface-treated respectively on a surface and another surface.From after a surface side fits in the two sides of polyimide resin substrate, utilize the copper foil on etching removal two sides, when printed article to being printed with linear label is photographed, in observation place-brightness chart of acquisition, the Sv that following (1) formulas define is that 10 mean roughness Rz for being TD measured by the laser microscopes of 405nm using laser light wavelength of 3.5 or more, Sv=(Δ B × 0.1)/(t1-t2) (1) another surface treated copper foil surface are 0.35 μm or more. |
| priorityDate |
2013-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |