http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105755574-B

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filingDate 2016-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105755574-B
titleOfInvention A kind of etching Wiring technology for increasing setline
abstract The present invention relates to touch-screen etching technique field, and in particular to a kind of etching Wiring technology for increasing setline, comprises the following steps:(1)Flexible base plate is provided, in the ITO conductive layer surface silk-screen etch resistant ink layer of flexible base plate;(2)Etching machines etching flexible base plate is enabled, the first setline of contact flexible base plate lower surface is provided between adjacent rollers 1;Roller group drives flexible base plate movement, and the part that multiple nozzles spray etching solutions are not covered ITO conductive layer by etch resistant ink layer removes;(3)Ink removing device sprinkling oil removing black liquid removes etch resistant ink layer.Between the good setline of pliability and resistance to acids and bases is interspersed in the roller of etching line by the present invention, and coordinates and setline is set in the top of flexible base plate, flexible base plate alice or depression in etching process can be prevented;The each component of etching solution is engaged, and etches uniform and stable, the electrode pattern neat in edge after etching;Cost of the present invention is low, technique is simple and etching efficiency is high.
priorityDate 2016-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 36.