| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2311-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2014-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105745360-B |
| titleOfInvention |
Copper foil, copper clad laminate and printed substrate with carrier foils |
| abstract |
It is an object of the invention to provide a kind of copper clad laminate for the temperature for being used in and loading more than 250 DEG C to be manufactured, and the copper foil with carrier foils of carrier foils can also be easily peeled off from copper foil layer.In order to realize the purpose, present invention employs the copper foil with carrier foils that the layer with carrier foils/adhesive interface layer/copper foil layer is formed, it is characterised in that has 40kgf/mm after having carried out the heating of 250 DEG C × 60 minutes as carrier foils use 2 The electrolytic copper foil of tensile strength above. |
| priorityDate |
2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |